This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.
Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management
By Paul D. Franzon (Editor), Erik Jan Marinissen (Editor), Muhannad S. Bakir (Editor), Philip Garrou (Series Editor), Mitsumasa Koyanagi (Series Editor), Peter Ramm (Series Editor)
May 2019 • 488 Pages • $215.00
Handbook of 3D Integration, Volumes 1 and 2: Technology and Applications of 3D Integrated Circuits
Philip Garrou (Editor), Christopher Bower (Editor), Peter Ramm (Editor)
October 2012 • 799 Pages • $197.00
Handbook of 3D Integration, Volume 3: 3D Process Technology
Philip Garrou (Editor), Mitsumasa Koyanagi (Editor), Peter Ramm (Editor)
July 2014 • 474 Pages • $170.00